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22.5% Smaller Photorelay Offers High-Current / Wide Temp.

February 6, 2017

Toshiba America Electronic Components, Inc. (TAEC) has added a new photorelay to its extensive lineup of photocouplers. Housed in the Toshiba-developed S-VSON4, claimed to be the industry's smallest package, the new TLP3406S is suited for use in automatic test equipment, measuring instruments, high-speed logic IC testers, high-speed memory testers, and probe cards.

Semiconductor testers and other applications are pushing photorelays to support higher temperatures in a smaller package size. Toshiba has answered the call with its new TLP3406S. The upper end of the TLP3406S's operating range is 110 degrees C (maximum), which is up from 85 degrees C (maximum) in previous offerings. In spite of its small package size, the TLP3406S features a very small on-resistance and on/off switching of currents as high as 1.5A, enabling it to be used for switching applications in high-speed testers.

The use of Toshiba's S-VSON4 package (2.00mm × 1.45mm) reduces the mounting area by approximately 22.5 percent when compared to larger VSON4 packages (2.45mm × 1.45mm). This reduction in size will enable the development of smaller test boards, and can increase density by allowing for the inclusion of more photorelays on a board.

Features include: OFF-state output terminal voltage rating: Voff = 30V; ON-state current rating: Ion = 1.5A; ON-state current rating (pulsed) Ionp = 4.5A; ON-state resistance Ron = 0.2Ω (maximum); and OFF-state current Ioff = 1nA (maximum).

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