December 8, 2016
Texas Instruments (TI) claims the industry's highest-density, 18-V input, 35-A synchronous dc-dc buck converter, which offers full differential remote-voltage sensing and PMBus to support telemetry. TI's TPS546C23 power converter integrates high- and low-side MOSFETs into a small-footprint package that is significantly denser than competitive devices. Designers can stack two converters in parallel to drive loads up to 70A for processors in space-constrained and power-dense applications in various markets, including wired and wireless communications, enterprise and cloud computing, and data storage systems.
December 8, 2016
Sol Chip announced the introduction of its Sol Chip Comm™ autonomous, wireless, solar tag for enabling precision agriculture and smart irrigation. The Sol Chip Comm (SCC) device is an ultra-compact, maintenance-free, solar-powered, wireless tag. SCC powers, controls and wirelessly connects a wide variety of sensors to the Cloud.
December 5, 2016
President & CEO, AnDAPT, Inc.
The AnDAPT Adaptive Multi-Rail Power (AmP™) platform delivers the industry's first, on-demand power management solution for a wide range of applications. AmP platforms integrate µAnalog elements, each with a digital wrapper, embedded on an interconnect fabric.
December 31, 2015
A team of engineers from Cornell University, the University of Notre Dame and the semiconductor company IQE plc has created gallium-nitride (GaN) power diodes capable of serving as the building blocks for future GaN power switches — with applications spanning nearly all electronics products and electricity distribution infrastructures. Along with having many desirable features as a material, GaN is notorious for its defects and reliability issues. So the team zeroed in on devices based on GaN with record-low defect concentrations to probe GaN's ultimate performance limits for power electronics. They describe their results in a paper in the journal Applied Physics Letters.